Siemens 6AG2137-6BD00-1BA0 Communication module SIPLUS ET 200SP CM 4XIO-Link ST

SIPLUS ET 200SP CM 4XIO-Link ST -25 ... +55°C T1 with 70°C for 10 min with conformal coating based on 6ES7137-6BD00-0BA0 . CM 4xIO-Link ST Communication Module IO-Link Master V1.1 The SIMATIC ET 200SP is a modular, scalable and highly flexible, decentralized I/O system. Due to its small footprint, it is particularly designed for installation in small control boxes close to the machine. The modules can either be plugged directly into an ET 200SP CPU or connected to a central controller via PROFINET or PROFIBUS. The SIMATIC ET 200SP can be expanded with up to 64 I/O modules, which can be plugged in in any combination. The system offers a very extensive range of modules. Many modules are also available in different versions, which significantly improves scalability in terms of functionality and price. In addition to modules with standard functionality (ST), there are also modules with an extended range of functions and diagnostics (HF High Feature / HS High Speed). Modules with basic functionality (BA) are available for price-sensitive applications. The advantage of the ET 200SP system lies in its ease of use, for example through the free choice of PROFINET connection technology via the bus adapter, tool-free wiring using push-in technology, improved accessibility of the wiring through the new arrangement of the spring openers next to the associated conductor opening and the channel-specific diagnostic functions. The option of changing modules and terminal boxes during operation, known as hot swapping, ensures the availability and productivity of the machine. Communication modules from SIPLUS extreme are specially designed for harsh environmental conditions. So that biologically, chemically and mechanically active substances do not affect your automation.