Lightweight, robust design through the use of light metals, anodized surface, positioning on the cable using a clamping system, optimal sliding properties thanks to coated contact surfaces, switch lever for activating/deactivating the axial feed, axial feed in both directions possible, stripping process possible at any point on the cable, shape of the blade ensures a conical shape on the semiconductor, blade made of hardened steel, cutting depth adjustable from 0 to 1.5 mm, cutting depth can be limited or blocked, rotation diameter max. 200 mm, controlled chip guidance using a device on the device
